Sudden changes in ?ow velocity cause transient pressure changes in the pipeline system. This phenomenon called “Water Hammer” may occur by Pump Start / Stop / Trip or Valve Open / Close, and it sometimes damages pipelines, pumps or valves. In particular, some long pipeline systems have high risk for Water Hammer. Therefore, Water Hammer Analysis is required in the system design to avoid damages of pipeline system.

Design of intake channels and suction pits in the pumping stations must be suitable for reliable and efficient pump operation. If inadequate, uneven intake ?ow or harmful vortex ?ow which lead to vibration or a drop in performance might be generated. Therefore, CFD analysis shall be calculated to con?rm the suitable design of intake channels and suction pits.

Seawater is used at many facilities, including desalination plants and power plants that use large amounts of cooling water. However, stainless steel and other materials corrode in seawater. Ebara has extensive knowledge and experience in dealing with the causes of corrosion, e.g., sea-area-dependant salt concentrations and temperatures, material types, di?erence of potential between materials, water ?ow, and velocity di?erences. Thus, we can ensure the stable pumping of seawater through the proper selection of materials, cathodic corrosion protection, BEM-based corrosion prediction analysis, the development of duplex stainless steel fabricated pumps, etc.

While duplex stainless steel was not previously used for pumps because of the di?culty in welding, Ebara has overcome this challenge by using a proprietary welding technique and developing large fabricated seawater pumps made of duplex stainless steel that are highly resistant to seawater corrosion.  These pumps are currently in operation at various facilities using large amounts of seawater.

Repetitive collisions between sand from the water with the surface of the impeller and other pump internal components causes erosion during pumping.  In addition to the use of hard materials, Ebara ensures stable pump operation through erosion rate prediction and erosion protection, such as the spraying of coating containing ceramic.

To ensure high product reliability and long service life, it is important to properly evaluate the strength and deformation of pumps under severe operating conditions, e.g., highpressure operation. By combining advanced numerical simulations and experiments, Ebara comprehensively evaluates the strength/deformation of products to achieve their high reliability and long service life.

Vibration/noise must be kept to a minimum for the sake of each pump, piping upstream/downstream of the pump, the building in which the pump is installed, and the entire pump station structure. To ensure safe and stable pump operation, Ebara properly evaluates vibration/noise in the entire pump station by using numerical simulation and long-established measurement/evaluation techniques.

To safely operate pumps that run at high speed, the dynamics of pump elements that a?ect shaft stability(shaft seal, bearing, impeller, etc.) and the ?uid force on each element must be correctly understood. Ebara uses unique rotor dynamics test stands based on magnetic bearing technology to measure ?uid forces on shaft seals, bearings, and impellers in di?erent shaft vibration modes that can occur during high-speed pump operation. This technology has also been used to evaluate the rotational stability of JAXA’s rocket pumps.

As carbon capture and storage (CCS) is gaining increasing attention as a measure against global warming, there are high expectations for injection pumps to inject liquefied carbon dioxide into the ground. Bearings for safe and stable pump operation under high-pressure conditions and seal technology to prevent external leakage of acid gas are also important.

Ebara dry vacuum pumps are used in manufacturing processes of semiconductor and display as well as instruments of precise measurements and analysis. Plants of semiconductor and display require our pumps to function without fail 24 hours a day, 365 days a year. In addition, saving energy demands such as the power consumption reduction increase as well as pumping performance enhancement for the pump. Ebara works closely with clients to develop and deliver products that achieve efficiency and energy goals that match your needs.

Semiconductor manufacturing equipment, which require completely dust free environments, need to be installed in a clean room with high-performance air conditioning systems. A clean room can be costly to maintain according to size.
Therefore, it is important for our dry vacuum pumps to be small foot print. We have developed pumps with smaller instrumentation and improved layouts that reduce your footprint beyond expectations.

※ Pumping speed comparison of 7,000 ~ 10,000 L/min class
※ Power consumption line graph comparison of the model A70W class

For circuit integration^※ of semiconductor devices, a finer and more multi-stratified wire circuit on the semiconductor wafer is indispensable. This is supported by a CMP system that planarizes fine irregularities on the surface of the semiconductor wafer.

The semiconductor device is realized by forming thin film of insulating material and conductive material on the surface of wafer with the use of a dedicated device and processing it into a fine circuit. In this process, however, the surface of the circuit becomes uneven. The CMP system turns it into a flat surface with roughness in the range of 10 to 20nm, which is equivalent to irregularity of 0.5mm on the inner side of the Yamanote rail line (with average diameter of 10km). With such high-accuracy planarization, we can laminate more than ten layers of fine circuits and thereby realize the high-level circuit integration of semiconductor devices.

The CMP system polishes a rotating wafer by pressing it on a rotating table attached with resin sheet, while pouring polishing liquid that contains fine abrasive grains and chemical solution. Ebara is a pioneer that has developed the Dry-in/Dry-out system for performing polishing, cleaning and drying inside CMP system in order to adapt polished wafers to the clean manufacturing environment of semiconductors and thereby enable installation of CMP system in clean rooms.

※ Circuit integration: Circuit integration refers to forming many transistors and memory elements within a semiconductor device of limited area, thereby enabling higher performance to be combined with more compact size.